The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2015

Filed:

Jan. 30, 2014
Applicant:

Cree, Inc., Durham, NC (US);

Inventors:

Florin A. Tudorica, Chapel Hill, NC (US);

Christopher P. Hussell, Cary, NC (US);

Amber C. Abare, Durham, NC (US);

Peter Scott Andrews, Durham, NC (US);

Sung Chul Joo, Cary, NC (US);

Assignee:

Cree, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 25/075 (2006.01); H01L 33/50 (2010.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01); H01L 33/52 (2010.01);
U.S. Cl.
CPC ...
H01L 33/505 (2013.01); H01L 24/48 (2013.01); H01L 24/83 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 33/52 (2013.01); H01L 2224/45099 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/8592 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/10156 (2013.01);
Abstract

Light emitter devices for light emitting diodes (LED chips) and related methods are disclosed. In one embodiment a light emitter device includes a substrate and a chip on board (COB) array of LED chips disposed over the substrate. A layer having wavelength conversion material provided therein is disposed over the array of LED chips for forming a light emitting surface from which light is emitted upon activation of the LED chips. In some aspects, the wavelength conversion material includes phosphoric or lumiphoric material that is settled and/or more densely concentrated within one or more predetermined portions of the layer. In some aspects, the devices and methods provided herein can comprise a lumen density of approximately 30 lm/mmor greater.


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