The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2015

Filed:

Sep. 20, 2011
Applicant:

Naoki Kohda, Kakogawa, JP;

Inventor:

Naoki Kohda, Kakogawa, JP;

Assignee:

Daishinku Corporation, Kakogawa-shi, JP;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H03H 9/10 (2006.01); B81B 7/00 (2006.01); H01L 23/13 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01); H03H 9/21 (2006.01);
U.S. Cl.
CPC ...
H03H 9/1021 (2013.01); B81B 7/007 (2013.01); H01L 23/13 (2013.01); H01L 23/15 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); B81B 2207/096 (2013.01); H03H 9/21 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A sealing member for an electronic component package includes, on another principal surface of a base material constituting the sealing member for the electronic component package, an external terminal electrode, a wiring pattern, and a resin material. The external terminal electrode is to be electrically coupled to an outside of the electronic component package. The wiring pattern is configured to couple an electronic component element on one principal surface of the base material to the external terminal electrode. The resin material is layered over the other principal surface and the wiring pattern. The external terminal electrode is layered over the wiring pattern and the resin material.


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