The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2015
Filed:
Jun. 27, 2006
Joachim Berthold, Kelkheim, DE;
Heinz Vogt, Frankfurt, DE;
James Stern, Houston, TX (US);
Albert Weber, Cervelló, ES;
Joachim Berthold, Kelkheim, DE;
Heinz Vogt, Frankfurt, DE;
James Stern, Houston, TX (US);
Albert Weber, Cervelló, ES;
Basell Polyolefine GmbH, Wesseling, DE;
Abstract
The invention relates to a polyethylene molding composition which has a multimodal molecular mass distribution and comprises a low molecular weight ethylene homopolymer A, a high molecular weight ethylene copolymer B and an ultrahigh molecular weight ethylene copolymer C. The molding composition has a density at a temperature of 23° C. in the range from 0.940 to 0.957 g/cm, an MFR (190° C./2.16 kg) in the range from 0.5 to 4 dg/min and a viscosity number VNof the mixture of ethylene homopolymer A, copolymer B and ethylene copolymer C, measured in accordance with ISO/R 1191 in decalin at a temperature of 135° C., in the range from 150 to 300 cm/g. The invention further relates to the use of such a molding composition for producing injection-molded finished parts, and to finished parts produced by injection molding.