The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2015
Filed:
Sep. 30, 2011
Christian Priebe, Wülfrath, DE;
Diether Koch, Mettmann, DE;
Christian Priebe, Wülfrath, DE;
Diether Koch, Mettmann, DE;
Ask Chemicals GmbH, Hilden, DE;
Abstract
A binder for mold material mixtures is a four-component material. It contains at least one phenolic resin component, at least one isocyanate component, at least one alkyl/alkenyl benzene and at least one dialkylated and/or dialkenylated naphthalene. The phenolic resin component acts as the polyol component and contains phenolic resin obtainable from the reaction between a phenol compound and an aldehyde compound. The isocyanate component contains at least one polyisocyanate with at least two NCO groups per molecule. The alkyl/alkenyl benzene has a boiling point above 250° C. The dialkylated and/or dialkenylated naphthalene has a boiling point above 270° C.