The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2015
Filed:
May. 16, 2014
Jsp Corporation, Chiyoda-ku, JP;
Masaomi Shima, Mie, JP;
JSP Corporation, Chiyoda-ku, JP;
Abstract
Disclosed is expandable modified resin beads (), comprising a modified resin as a base resin in which a dispersion phase () containing a styrene resin as a major component is dispersed in a continuous phase () containing an olefin resin as a major component, and a physical blowing agent. Further disclosed are expanded modified resin beads obtained by expanding the expandable modified resin beads (), and a foamed molded article formed from the expanded modified resin beads obtained by molding the expanded modified resin beads in a mold. A volume average diameter of the dispersion phase () dispersed in the continuous phase () is 0.55 μm or more. The expandable modified resin beads () have, as a base resin, the modified resin contains 80 to 50 parts by mass of the styrene resin with respect to 20 to 50 parts by mass parts of the olefin resins.