The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2015

Filed:

Oct. 23, 2012
Applicants:

Sumitomo Electric Industries, Ltd., Osaka-shi, JP;

National University Corporation Nara Institute of Science and Technology, Ikoma-shi, JP;

Inventors:

Takeyoshi Masuda, Osaka, JP;

Tomoaki Hatayama, Ikoma, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 29/861 (2006.01); H01L 29/78 (2006.01); H01L 29/06 (2006.01); H01L 29/868 (2006.01); H01L 29/739 (2006.01); H01L 21/308 (2006.01); H01L 21/3065 (2006.01); H01L 29/12 (2006.01); H01L 21/02 (2006.01); H01L 29/16 (2006.01);
U.S. Cl.
CPC ...
H01L 29/8613 (2013.01); H01L 29/78 (2013.01); H01L 21/02576 (2013.01); H01L 29/0615 (2013.01); H01L 29/868 (2013.01); H01L 29/739 (2013.01); H01L 21/0262 (2013.01); H01L 29/06 (2013.01); H01L 21/3083 (2013.01); H01L 21/02529 (2013.01); H01L 29/1608 (2013.01); H01L 29/861 (2013.01); H01L 29/0619 (2013.01); H01L 21/3065 (2013.01); H01L 29/12 (2013.01); Y10S 438/931 (2013.01);
Abstract

On a substrate, a silicon carbide layer provided with a main surface is formed. A mask is formed to cover a portion of the main surface of the silicon carbide layer. The main surface of the silicon carbide layer on which the mask is formed is thermally etched using chlorine-based gas so as to provide the silicon carbide layer with a side surface inclined relative to the main surface. The step of thermally etching is performed in an atmosphere in which the chlorine-based gas has a partial pressure of 50% or smaller.


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