The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2015
Filed:
Apr. 18, 2014
James M. Holden, San Jose, CA (US);
Aparna Iyer, Sunnyvale, CA (US);
Brad Eaton, Menlo Park, CA (US);
Ajay Kumar, Cupertino, CA (US);
James M. Holden, San Jose, CA (US);
Aparna Iyer, Sunnyvale, CA (US);
Brad Eaton, Menlo Park, CA (US);
Ajay Kumar, Cupertino, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Approaches for protecting a wafer during plasma etching wafer dicing processes are described. In an example, a method of dicing a semiconductor wafer with a front surface having a plurality of integrated circuits thereon involves laminating a pre-patterned mask on the front surface of the semiconductor wafer. The pre-patterned mask covers the integrated circuits and exposes streets between the integrated circuits. The method also involves plasma etching the semiconductor wafer through the streets to singulate the integrated circuits. The pre-patterned mask protects the integrated circuits during the plasma etching.