The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2015

Filed:

Mar. 28, 2008
Applicant:

BO Soon Chang, Cupertino, CA (US);

Inventor:

Bo Soon Chang, Cupertino, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01);
Abstract

An embodiment of the present invention is directed to a semiconductor packaging frame allowing identification information to be stored in the paddle area of the individual frame. Forming identification information on the paddle allows unique tracking of the semiconductor frame package during and after manufacturing and for tracking down variances, defects, and other problems during the semiconductor packaging process. Further, the shapes formed from the identification information provide increased surface area for bonding of the molding compound and thus strengthen the bond between the die paddle and molding compound thereby improving the strength of the semiconductor package.


Find Patent Forward Citations

Chang, Bo. (2015). Semiconductor packaging identifier (U.S. Patent No. 8999752). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8999752

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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