The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2015

Filed:

Feb. 14, 2013
Applicants:

International Business Machines Corporation, Armonk, NY (US);

Shin-etsu Chemical Co., Ltd., Joetsu-shi, Niigata-ken, JP;

Inventors:

Martin Glodde, Mahwah, NJ (US);

Wu-Song Huang, Brewster, NY (US);

Javier Perez, Wappingers Falls, NY (US);

Ratnam Sooriyakumaran, San Jose, CA (US);

Takeshi Kinsho, Joetsu, JP;

Tsutomu Ogihara, Joetsu, JP;

Seiichiro Tachibana, Joetsu, JP;

Takafumi Ueda, Joetsu, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/075 (2006.01); G03F 7/09 (2006.01); G03F 7/20 (2006.01); G03F 7/30 (2006.01); G03F 7/36 (2006.01);
U.S. Cl.
CPC ...
G03F 7/20 (2013.01); G03F 7/0757 (2013.01);
Abstract

Embodiments include a silicon-containing antireflective material including a silicon-containing base polymer, a non-polymeric silsesquioxane material, and a photoacid generator. The silicon-containing base polymer may contain chromophore moieties, transparent moieties, and reactive sites on an SiObackground, where x ranges from approximately 1 to approximately 2. Exemplary non-polymeric silsesquioxane materials include polyhedral oligomeric silsesquioxanes having acid labile side groups linked to hydrophilic groups Exemplary acid labile side groups may include tertiary alkyl carbonates, tertiary alkyl esters, tertiary alkyl ethers, acetals and ketals, Exemplary hydrophilic groups may include phenols, alcohols, carboxylic acids, amides, and sulfonamides. Embodiments further include lithographic structures including an organic anti-reflective layer, the above-described silicon-containing anti-reflective layer above the organic anti-reflective layer, and a photoresist layer above the above-described silicon-containing anti-reflective layer. Embodiments further include a method of forming a lithographic structure utilizing the above-described silicon-containing anti-reflective layer.


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