The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2015

Filed:

Feb. 03, 2012
Applicants:

Arunkumar Shamrao Watwe, Greenville, SC (US);

Yuk-chiu Lau, Schenectady, NY (US);

Inventors:

Arunkumar Shamrao Watwe, Greenville, SC (US);

Yuk-Chiu Lau, Schenectady, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/00 (2006.01); B22F 9/04 (2006.01); B32B 5/16 (2006.01); C22C 1/10 (2006.01); C22C 32/00 (2006.01); C22C 33/02 (2006.01); C23C 4/08 (2006.01); C23C 4/06 (2006.01); C23C 24/04 (2006.01); B22F 5/04 (2006.01);
U.S. Cl.
CPC ...
C22C 1/1084 (2013.01); C01P 2004/90 (2013.01); C01P 2004/80 (2013.01); B23C 2222/61 (2013.01); B22F 5/04 (2013.01); C22C 32/0026 (2013.01); C22C 33/02 (2013.01); C23C 4/085 (2013.01); C23C 4/065 (2013.01); C23C 24/04 (2013.01);
Abstract

Provided is bond coating powder and method of making. The method includes providing a powder including a plurality of parent particles. The method includes providing a plurality of dispersoids. The method includes mechanically alloying the powder and the plurality of dispersoids at ambient temperature. The mechanical alloying operable to provide a selective occupation of the plurality of dispersoids in a grain boundary area of the plurality of parent particles providing the bond coating powder. The plurality of dispersoids occupy about 18 percent to about 30 percent of the grain boundary area of the bond coating powder.


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