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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8999450 B1

PDFFull Text
Date of Patent:
Apr. 07, 2015

Filed:

Sep. 28, 2009

Metal salt-containing composition, substrate, manufacturing method of substrate

Applicants:

Yasuteru Saito, Osaka, JP;

Naoki Ike, Kyoto, JP;

Inventors:

Yasuteru Saito, Osaka, JP;

Naoki Ike, Kyoto, JP;

Assignee:

Dai-Ichi Kogyo Seiyaku Co., Ltd., Kyoto, JP;

Attorney:

Marshall, Gerstein & Borun LLP

Primary Examiner:

Nathan Empie

Int. Cl.
CPC ...
B05D 3/02 (2006.01); C01G 25/02 (2006.01); C01G 3/00 (2006.01); C01G 3/02 (2006.01); C01G 9/00 (2006.01); C01G 9/02 (2006.01); C01G 15/00 (2006.01); C01G 19/02 (2006.01); C01G 23/04 (2006.01); C01G 33/00 (2006.01); C01G 37/027 (2006.01); C01G 39/02 (2006.01); C01G 49/02 (2006.01); C01G 53/04 (2006.01); C23C 18/12 (2006.01);
U.S. Cl.
CPC ...
C01G 25/02 (2013.01); C01G 3/00 (2013.01); C01G 3/02 (2013.01); C01G 9/00 (2013.01); C01G 9/02 (2013.01); C01G 15/00 (2013.01); C01G 19/02 (2013.01); C01G 23/04 (2013.01); C01G 33/00 (2013.01); C01G 37/027 (2013.01); C01G 39/02 (2013.01); C01G 49/02 (2013.01); C01G 53/04 (2013.01); C01P 2004/03 (2013.01); C01P 2006/82 (2013.01); C23C 18/1216 (2013.01); C23C 18/1283 (2013.01);
Abstract

An object of the present invention is to provide a method for manufacturing a substrate having a metal complex film on the surface thereof. According to the present invention, a metal salt-containing composition containing a metal salt, a polyvalent carboxylic acid having a cis-form structure, and a solvent, in which: the molar ratio of the polyvalent carboxylic acid to the metal salt is not less than 0.5 and not more than 4.0; the moisture content of the composition is not less than 0.05% by weight is used in an application method to apply on a substrate. Thereafter, a two-step heat treatment is carried out.

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