The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2015

Filed:

Dec. 01, 2009
Applicants:

Ramaswamy Nagarajan, Dracut, MA (US);

Sharavanan Balasubramaniam, Blacksburg, VA (US);

Julie Chen, Wilmington, MA (US);

Joey Mead, Carlisle, MA (US);

Inventors:

Ramaswamy Nagarajan, Dracut, MA (US);

Sharavanan Balasubramaniam, Blacksburg, VA (US);

Julie Chen, Wilmington, MA (US);

Joey Mead, Carlisle, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 (2006.01); H05K 1/09 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 1/097 (2013.01); H05K 3/105 (2013.01); H05K 2201/0245 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/121 (2013.01);
Abstract

Metal flakes, an organic metal precursor, an organic solvent and either no binder, or a volatile or a thermally decomposable binder are combined to form a paste. The paste is deposited in a circuit pattern on a substrate and the circuit pattern is cured. While curing, the organic metal precursor decomposes to leave an electrically conductive path, and the printed circuit is thus formed. A precursor to an electrically conductive circuit material includes an organic metal precursor, metal microparticles, and an organic solvent. The method can be employed to form printed circuits, for a variety of electrical, electronic and sensing application, such as crack detection in ceramic, plastics, concrete, wood, fabric, leather, rubber or paper and composite materials.


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