The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2015
Filed:
Jan. 24, 2013
Applicant:
Soitec, Bernin, FR;
Inventors:
Gweltaz Gaudin, Grenoble, FR;
Fabrice Lallement, Aix-les-Bains, FR;
Cyrille Colnat, St. Martin d'Heres, FR;
Pascale Giard, St. Martin d'Heres, FR;
Assignee:
SOITEC, Bernin, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/00 (2006.01); H01L 21/18 (2006.01); H01L 21/67 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 21/187 (2013.01); H01L 21/67092 (2013.01); H01L 21/76251 (2013.01);
Abstract
The invention relates to a method for bonding two substrates, in particular, two semiconductor substrates that, in order to be able to improve the reliability of the process, provides the step of providing a gaseous flow over the bonding surfaces of the substrates. The gaseous flow is preferably a laminar flow that is essentially parallel to the bonding surfaces of the substrates, and has a temperature in a range of from room temperature up to 100° C.