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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8999086 B1

PDFFull Text
Date of Patent:
Apr. 07, 2015

Filed:

Aug. 13, 2008

Joining of mouldings of different polyamide compounds

Applicants:

Sonja Bollmann, Haltern am See, DE;

Rainer Goering, Borken, DE;

Franz-erich Baumann, Duelmen, DE;

Andreas Dowe, Borken, DE;

Vera Schiemann, Marl, DE;

Inventors:

Sonja Bollmann, Haltern am See, DE;

Rainer Goering, Borken, DE;

Franz-Erich Baumann, Duelmen, DE;

Andreas Dowe, Borken, DE;

Vera Schiemann, Marl, DE;

Assignee:

Evonik Degussa GmbH, Essen, DE;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Callie Shosho

Assistant Examiner:

John Freeman

Int. Cl.
CPC ...
B29C 65/00 (2006.01); C08L 77/02 (2006.01); C09J 5/06 (2006.01); C08J 5/12 (2006.01); B29C 65/06 (2006.01); B29C 65/08 (2006.01); B29C 65/10 (2006.01); B29C 65/14 (2006.01); B29C 65/16 (2006.01); B29C 65/20 (2006.01); B29C 65/34 (2006.01); B29C 65/82 (2006.01); B29K 77/00 (2006.01); B29K 101/12 (2006.01); B29L 23/00 (2006.01);
U.S. Cl.
CPC ...
C09J 5/06 (2013.01); B29C 65/06 (2013.01); B29C 65/0672 (2013.01); B29C 65/08 (2013.01); B29C 65/10 (2013.01); B29C 65/14 (2013.01); B29C 65/1435 (2013.01); B29C 65/16 (2013.01); B29C 65/20 (2013.01); B29C 65/34 (2013.01); B29C 65/342 (2013.01); B29C 65/8207 (2013.01); B29C 66/71 (2013.01); B29C 66/712 (2013.01); B29K 2077/00 (2013.01); B29K 2101/12 (2013.01); B29L 2023/22 (2013.01); C08J 5/121 (2013.01); C08J 2377/00 (2013.01); C08L 77/02 (2013.01); B29C 65/3476 (2013.01); B29C 65/8215 (2013.01); B29C 66/522 (2013.01);
Abstract

A molding compound for joining two moldings each made of a PA11 and/or PA12 molding compound contains at least 50% by weight of a polyamide component so chosen that it is preparable from linear aliphatic diamines and dicarboxylic acids and/or lactams or ω-aminocarboxylic acids, there being 11 to 12 carbon atoms present per carboxamide group in the repeating units, and, furthermore, this polyamide component containing not more than 80% by weight of either one of the polyamides PA11 and PA12. With this compound a firm weld is obtained both to a PA11 molding and to a PA12 molding.

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