The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2015

Filed:

Mar. 15, 2013
Applicants:

Sumitomo Electric Printed Circuits, Inc., Koka, Shiga, JP;

Power Gold Llc, Phoenix, AZ (US);

Inventors:

James Jen-Ho Wang, Phoenix, AZ (US);

Jin Joo Park, Takarazuka, JP;

Assignees:

Sumitomo Electric Printed Circuits, Inc., Koka, Shiga, JP;

Power Gold LLC, Phoenix, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 29/00 (2006.01); F21V 19/00 (2006.01); F21K 99/00 (2010.01); H05K 1/02 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
F21V 19/003 (2013.01); F21K 9/00 (2013.01); F21K 9/90 (2013.01); H05K 1/028 (2013.01); H05K 3/306 (2013.01);
Abstract

A flexible circuit assembly for accommodating a plurality of power electronic devices, including an insulating cover layer having first openings for power electronic devices, a flexible conductive layer arranged under the insulating cover layer and attached with a first adhesive to the insulating cover layer, an intermediate insulating layer arranged under the flexible conductive layer and attached with a second adhesive to the flexible conductive layer, the intermediate insulating layer having second openings, a plurality of heat-conductive elements arranged inside the second openings, a first thin heat sink layer, the heat-conductive elements arranged to be in contact with an upper surface of the thin heat sink layer and the lower surface of the islands via heat-conductive material; and a second thin heat sink layer, upper surfaces of the power electronic devices arranged to be in contact with a lower surface of the thin heat sink layer and the lower surface of the islands via heat-conductive material.


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