The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2015

Filed:

Dec. 20, 2012
Applicant:

Seiko Instruments Inc., Chiba-shi, Chiba, JP;

Inventors:

Toshimitsu Morooka, Chiba, JP;

Keitaro Koroishi, Chiba, JP;

Noriyoshi Shoji, Chiba, JP;

Norimitsu Sanbongi, Chiba, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41J 2/05 (2006.01); B41J 2/335 (2006.01);
U.S. Cl.
CPC ...
B41J 2/3351 (2013.01); B41J 2/3359 (2013.01); B41J 2/33545 (2013.01); B41J 2/3355 (2013.01); B41J 2/3357 (2013.01); B41J 2/33585 (2013.01);
Abstract

A thermal head including: a laminated substrate including a support substrate and an upper substrate at least one of which has a recess formed in a surface thereof; a heat generating resistor formed on a surface of the upper substrate in the laminated substrate at a position opposed to the recess; and a pair of electrode portions connected to each of both ends of a heat generating resistor, wherein the laminated substrate further includes: an intermediate metal layer sandwiched between the support substrate and the upper substrate and bonded thereto in a laminated state; and a surrounding metal layer formed of a metal material, the surrounding metal layer provided in contact with the intermediate metal layer and formed from a surface of the support substrate extending in a thickness direction thereof to a surface thereof opposite to a portion bonded to the upper substrate.


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