The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2015
Filed:
Oct. 20, 2010
Shih Chang Chang, San Jose, CA (US);
John Z. Zhong, Cupertino, CA (US);
Lili Huang, San Jose, CA (US);
Seung Jae Hong, Sunnyvale, CA (US);
Lynn Youngs, Cupertino, CA (US);
Shih Chang Chang, San Jose, CA (US);
John Z. Zhong, Cupertino, CA (US);
Lili Huang, San Jose, CA (US);
Seung Jae Hong, Sunnyvale, CA (US);
Lynn Youngs, Cupertino, CA (US);
Apple Inc., Cupertino, CA (US);
Abstract
A method for fabricating thin DITO or SITO touch sensor panels with a thickness less than a minimum thickness tolerance of existing manufacturing equipment. In one embodiment, a sandwich of two thin glass sheets is formed such that the combined thickness of the glass sheets does not drop below the minimum thickness tolerance of existing manufacturing equipment when thin film process is performed on the surfaces of the sandwich during fabrication. The sandwich may eventually be separated to form two thin SITO/DITO panels. In another embodiment, the fabrication process involves laminating two patterned thick substrates, each having at least the minimum thickness tolerance of existing manufacturing equipment. One or both of the sides of the laminated substrates are then thinned so that when the substrates are separated, each is a thin DITO/SITO panel having a thickness less than the minimum thickness tolerance of existing manufacturing equipment.