The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

Aug. 16, 2010
Applicants:

Torsten Melzer-jokisch, Neuenhagen bei Berlin, DE;

Dimitrios Thomaidis, Berlin, DE;

Rolf Wilkenhöner, Kleinmachnow, DE;

Inventors:

Torsten Melzer-Jokisch, Neuenhagen bei Berlin, DE;

Dimitrios Thomaidis, Berlin, DE;

Rolf Wilkenhöner, Kleinmachnow, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 19/00 (2011.01); B23P 6/00 (2006.01); F01D 5/00 (2006.01); G05B 19/4099 (2006.01); B23K 26/34 (2014.01); G01N 21/91 (2006.01);
U.S. Cl.
CPC ...
B23P 6/007 (2013.01); F01D 5/005 (2013.01); G05B 19/4099 (2013.01); B23K 26/345 (2013.01); G01N 21/91 (2013.01); G05B 2219/32228 (2013.01); F05D 2230/30 (2013.01); F05D 2230/10 (2013.01);
Abstract

A method and system for automated repair of a machine component is provided. According to the proposed method, a first geometry of the component, including a damaged portion of the component, is digitalized. A trough is then machined over the damaged portion of the component. The machining is numerically controlled using digitalized geometrical data of the first geometry of the component. A second geometry of the component is then digitalized subsequent to the machining, the second geometry including the trough. Subsequently, a material is deposited over the trough. The deposition of the material is numerically controlled digitalized geometrical data of the second geometry of the component.


Find Patent Forward Citations

Loading…