The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

Oct. 08, 2013
Applicant:

Second Sight Medical Products, Inc., San Fernando, CA (US);

Inventors:

Jerry Ok, Canyon Country, CA (US);

Robert J Greenberg, Los Angeles, CA (US);

Neil Hamilton Talbot, La Cresenta, CA (US);

James S Little, Newhall, CA (US);

Rongqing Dai, Valencia, CA (US);

Jordan Matthew Neysmith, Pasadena, CA (US);

Kelly H McClure, Simi Valley, CA (US);

Assignee:

Second Sight Products, Inc., Sylmar, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61N 1/375 (2006.01); A61N 1/36 (2006.01); A61F 15/00 (2006.01); A61N 1/05 (2006.01);
U.S. Cl.
CPC ...
A61N 1/36125 (2013.01); A61F 15/001 (2013.01); A61N 1/0543 (2013.01); A61N 1/36046 (2013.01); A61N 1/375 (2013.01); A61N 1/0529 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/45144 (2013.01);
Abstract

An implantable device, including a first electrically non-conductive substrate with a plurality of electrically conductive vias. The device also includes a flip-chip multiplexer circuit attached to the electrically non-conductive substrate using conductive bumps, the circuit being electrically connected to at a subset of the plurality of electrically conductive vias. Another a flip-chip driver circuit is attached to the flip-chip multiplexer circuit using conductive bumps while a second electrically non-conductive substrate attached to the flip-chip driver circuit using conductive bumps. Discrete passives are attached to the second electrically non-conductive substrate and a cover is bonded to the first electrically non-conductive substrate. The cover, the first electrically non-conductive substrate and the electrically conductive vias form a hermetic package.


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