The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2015
Filed:
Dec. 14, 2012
Applicant:
Eos Photonics, Inc., Cambridge, MA (US);
Inventors:
Laurent Diehl, Cambridge, MA (US);
Christian Pfluegl, Medford, MA (US);
Mark F. Witinski, Cambridge, MA (US);
Assignee:
EOS Photonics, Inc., Cambridge, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 3/04 (2006.01); H01S 5/06 (2006.01); H01S 5/024 (2006.01); H01S 5/12 (2006.01); H01S 5/22 (2006.01); B82Y 20/00 (2011.01); H01S 5/00 (2006.01); H01S 5/026 (2006.01); H01S 5/0625 (2006.01); H01S 5/34 (2006.01); H01S 5/40 (2006.01);
U.S. Cl.
CPC ...
H01S 5/0612 (2013.01); H01S 5/02461 (2013.01); H01S 5/12 (2013.01); H01S 5/2224 (2013.01); B82Y 20/00 (2013.01); H01S 5/0014 (2013.01); H01S 5/0261 (2013.01); H01S 5/0265 (2013.01); H01S 5/06258 (2013.01); H01S 5/3402 (2013.01); H01S 5/4031 (2013.01); H01S 5/4087 (2013.01); H01S 5/222 (2013.01);
Abstract
The present technology relates to a fast and efficient heating element based on a thick heterostructure which is monolithically integrated in close proximity to one or more components of a photonic or an electronic circuit. Inventive embodiments also relate to methods of use illustrative heating elements to control or tune the characteristics of the electronic or photonic component(s). Inventive embodiments may be particularly useful in the fast spectral tuning of the emission wavelength of single mode QCLs.