The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

Aug. 24, 2010
Applicants:

Masato Saito, Hitachinaka, JP;

Hiroyuki Abe, Hitachiomiya, JP;

Inventors:

Masato Saito, Hitachinaka, JP;

Hiroyuki Abe, Hitachiomiya, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 1/18 (2006.01); H05H 1/03 (2006.01); H05K 1/00 (2006.01); H01L 23/24 (2006.01); H01L 23/29 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/24 (2013.01); H01L 23/296 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 25/16 (2013.01); H01L 23/3135 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/16315 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19107 (2013.01); H01L 24/48 (2013.01); H01L 2224/2919 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0665 (2013.01); H01L 2224/29101 (2013.01); H01L 24/49 (2013.01); H01L 2224/49111 (2013.01); H01L 2924/157 (2013.01);
Abstract

Provided is a power module invented for easy manufacturing and fatigue reduction at a soldered portion, and a method for manufacturing the same. The power module according to the present invention comprises a substrate where electronic parts are mounted by soldering, and a mold case housing the substrate and including bus bars for electrical connection with an external apparatus. The mold case comprises partition plates forming an electronic part mount area where electronic parts are mounted on the substrate, and a bonding area for bonding to the bus bars, a first resin cast to the electronic part mount area, and a second resin cast to the bonding area.


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