The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2015
Filed:
May. 21, 2012
Jose Alberto Saez-zamora, Terrassa, ES;
Xavier Jorda-sanuy, Cerdanyola del Valles, ES;
Jordi Suarez-jimenez, Terrassa, ES;
Jose Gabriel Fernandez-banares, Valls, ES;
Xavier Perpina-giribet, Cerdanyola del Valles, ES;
Miquel Vellvehi-hernandez, Cerdanyola del Valles, ES;
Laurent Aubouy, Terrassa, ES;
Jose Alberto Saez-Zamora, Terrassa, ES;
Xavier Jorda-Sanuy, Cerdanyola del Valles, ES;
Jordi Suarez-Jimenez, Terrassa, ES;
Jose Gabriel Fernandez-Banares, Valls, ES;
Xavier Perpina-Giribet, Cerdanyola del Valles, ES;
Miquel Vellvehi-Hernandez, Cerdanyola del Valles, ES;
Laurent Aubouy, Terrassa, ES;
Lear Corporation, Southfield, MI (US);
Abstract
In one embodiment, an apparatus for cooling an electrical component in a vehicle is provided. The apparatus comprises a power module including the electrical component for converting energy. The power module includes a first printed circuit board (PCB) including a first ceramic substrate for receiving the electrical component. The power module further includes a plurality of thermoelectric cells being coupled to the first PCB for discharging heat away from the electrical component. The power module further includes a second PCB including a second ceramic substrate being coupled to the plurality of thermoelectric cells, the first ceramic substrate and the second ceramic substrate for electrically isolating the electrical component from the first PCB and the second PCB and for providing thermal conductance from the electrical component through the plurality of thermoelectric cells.