The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

Feb. 24, 2012
Applicants:

Jin Nishiyama, Tokyo-to, JP;

Yuji Narita, Tokyo-to, JP;

Inventors:

Jin Nishiyama, Tokyo-to, JP;

Yuji Narita, Tokyo-to, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/48 (2006.01); H05K 1/11 (2006.01); H05K 1/05 (2006.01); H05K 3/42 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/118 (2013.01); G11B 5/486 (2013.01); H05K 1/0393 (2013.01); H05K 1/056 (2013.01); H05K 1/111 (2013.01); G11B 5/4806 (2013.01); H05K 3/42 (2013.01);
Abstract

A wiring circuit substrate, comprising: a metal support layer; an insulating layer formed on the metal support layer; a conductive layer for wiring formed on the insulating layer; and an opening formed so as to open at a same location in the insulating layer and the conductive layer for wiring, wherein the metal support layer includes: a support section that supports the insulating layer and the conductive layer for wiring, and a terminal section that extends from one edge side to the other edge side of the opening, the terminal section being separated from the support section; and the conductive layer for wiring includes a wiring that is connected to the terminal section by a connecting section.


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