The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

Aug. 30, 2013
Applicant:

Smiths Interconnect Microwave Components, Inc., Stuart, FL (US);

Inventors:

Paul Davidsson, Stuart, FL (US);

Robert Blacka, Port St. Lucie, FL (US);

Kai Loh, Port St. Lucie, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 7/10 (2006.01); H01C 7/13 (2006.01); H05K 7/20 (2006.01); H01C 1/01 (2006.01); H04B 1/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); H01C 1/01 (2013.01); H04B 1/00 (2013.01); H05K 1/0203 (2013.01); H05K 1/0204 (2013.01); H05K 1/0219 (2013.01); H05K 1/0243 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/10022 (2013.01);
Abstract

A surface mount chip resistor for increasing power handling capabilities of radio frequency (RF) circuits and for minimizing parasitic capacitance and inductance effects, the chip resistor includes a ceramic substrate having a main portion and an outrigger. A resistor element is between an input contact and an output contact on a top surface of the main portion. A ground plane attachment area is on a top surface of the outrigger. The ground plane attachment area is mounted to a ground plane of a circuit board to provide a heat pathway for dissipating heat generated by the resistor element.


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