The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

Jul. 21, 2009
Applicant:

Taras Kushta, Tokyo, JP;

Inventor:

Taras Kushta, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 1/203 (2006.01); H01P 7/04 (2006.01); H05K 1/02 (2006.01); H01P 1/205 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H01P 1/20345 (2013.01); H01P 7/04 (2013.01); H05K 1/0251 (2013.01); H01P 1/2056 (2013.01); H05K 1/0222 (2013.01); H05K 1/116 (2013.01); H05K 3/429 (2013.01); H05K 2201/09381 (2013.01); H05K 2201/09454 (2013.01); H05K 2201/09618 (2013.01); H05K 2201/09718 (2013.01);
Abstract

A resonant element is provided with a multilayer board, comprising a plurality of conductor layers isolated by a dielectric, a signal via conductor, penetrating through the multilayer board, and a plurality of ground vias, penetrating thought the multilayer board and disposed around the signal via conductor. The multilayer board comprises a first conductor layer, a second conductor layer, and a corrugated conductor layer disposed between the first and the second conductor layers. The corrugated conductor layer comprises a corrugated signal plate, connected to the signal via conductor, and a corrugated ground plate, connected to the plurality of ground vias, isolated from the corrugated signal plate by the dielectric.


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