The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

Jun. 12, 2012
Applicants:

Hirohisa Matsuki, Yokohama, JP;

Masao Sakuma, Yokohama, JP;

Inventors:

Hirohisa Matsuki, Yokohama, JP;

Masao Sakuma, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01Q 1/22 (2006.01); H01Q 9/04 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/561 (2013.01); H01L 24/97 (2013.01); H01Q 1/2283 (2013.01); H01Q 9/0407 (2013.01); H01L 21/76898 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/92 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/97 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/167 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/01029 (2013.01); H01L 2224/16225 (2013.01);
Abstract

A semiconductor device (semiconductor module) includes a circuit board (module board) and a semiconductor element mounted on the circuit board. A shielding layer that blocks electromagnetic waves is disposed on the upper surface of the semiconductor element, and an antenna element is disposed over the shielding layer. The semiconductor element and the antenna element are electrically connected to each other by a connecting portion. This structure enables the semiconductor device to be reduced in size and to have both an electromagnetic-wave blocking function and an antenna function.


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