The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2015
Filed:
Sep. 18, 2011
Applicant:
Jumpei Sato, Kawasaki, JP;
Inventor:
Jumpei Sato, Kawasaki, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 27/115 (2006.01); H01L 49/02 (2006.01); H01L 29/861 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11526 (2013.01); H01L 28/40 (2013.01); H01L 29/8611 (2013.01); H01L 24/05 (2013.01); H01L 2224/02166 (2013.01); H01L 2224/04042 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01021 (2013.01);
Abstract
According to one embodiment, a semiconductor device includes a semiconductor chip which includes a semiconductor integrated circuit provided in an insulator, a first pad a pad having an upper surface of which is exposed via an opening formed in the insulator, and capacitors provided in a capacitor region of the semiconductor chip under the pad. The capacitors are provided in the capacitor region to satisfy a rule of a coverage. And contacts respectively connected to two electrodes of the capacitors are provided at positions that do not vertically overlap the opening.