The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

Jul. 11, 2012
Applicants:

Adrian Avramescu, Regensburg, DE;

Volker Härle, Laaber, DE;

Lutz Höppel, Alteglofsheim, DE;

Matthias Peter, Alteglofsheim, DE;

Matthias Sabathil, Regensburg, DE;

Uwe Strauss, Bad Abbach, DE;

Inventors:

Adrian Avramescu, Regensburg, DE;

Volker Härle, Laaber, DE;

Lutz Höppel, Alteglofsheim, DE;

Matthias Peter, Alteglofsheim, DE;

Matthias Sabathil, Regensburg, DE;

Uwe Strauss, Bad Abbach, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01S 5/343 (2006.01); B82Y 20/00 (2011.01); H01L 33/04 (2010.01); H01S 5/042 (2006.01); H01L 33/06 (2010.01); H01L 33/32 (2010.01); H01S 5/20 (2006.01); H01S 5/30 (2006.01); H01S 5/32 (2006.01); H01S 5/34 (2006.01);
U.S. Cl.
CPC ...
H01S 5/34333 (2013.01); B82Y 20/00 (2013.01); H01L 33/04 (2013.01); H01S 5/0421 (2013.01); H01L 33/06 (2013.01); H01L 33/32 (2013.01); H01S 5/2009 (2013.01); H01S 5/3072 (2013.01); H01S 5/3095 (2013.01); H01S 5/3202 (2013.01); H01S 5/3407 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An optoelectronic semiconductor chip comprises the following sequence of regions in a growth direction (c) of the semiconductor chip (): a p doped barrier layer () for an active region (), the active region (), which is suitable for generating electromagnetic radiation, the active region being based on a hexagonal compound semiconductor, and an n doped barrier layer () for the active region (). Also disclosed are a component comprising such a semiconductor chip, and to a method for producing such a semiconductor chip.


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