The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

Jan. 13, 2013
Applicant:

Unimems Manufacturing Co., Ltd., Hsinchu, TW;

Inventor:

Tzong-Sheng Lee, Miaoli County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01J 5/10 (2006.01); H01L 31/18 (2006.01); H01L 27/144 (2006.01);
U.S. Cl.
CPC ...
H01L 31/18 (2013.01); H01L 27/1443 (2013.01);
Abstract

An infrared sensor array with interconnection type, comprises a substrate, a plurality of circuit units, and a plurality of infrared sensing modules. The substrate defines several sensing segments. Each sensing segment has a base portion, a connecting portion, and a testing portion. The connecting portion is arranged between the base portion and the testing portion. The circuit units are respectively formed on the sensing segments. Each circuit unit has a base circuit, a connecting circuit, and a testing circuit. The connecting circuit electrically connects to the base circuit and the testing circuit. Each base circuit is formed on each base portion, each connecting circuit is formed on each connecting portion, and each testing circuit is formed on each testing portion. The infrared sensing modules are respectively disposed on the base portions and electrically connected to the base circuits.


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