The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

Jan. 31, 2011
Applicants:

Nicholas John Winter, Luton, GB;

Stuart Martin Lewis, Luton, GB;

Peter English, Luton, GB;

Inventors:

Nicholas John Winter, Luton, GB;

Stuart Martin Lewis, Luton, GB;

Peter English, Luton, GB;

Assignee:

GKN Aerospace Services Limited, East Cowes, Isle of Wight, GB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 3/03 (2006.01); H05B 3/18 (2006.01); H05B 3/36 (2006.01); B64D 15/12 (2006.01);
U.S. Cl.
CPC ...
B64D 15/12 (2013.01); H05B 3/36 (2013.01); B64D 2700/62078 (2013.01); H05B 2203/013 (2013.01); H05B 2203/017 (2013.01); H05B 2203/033 (2013.01); H05B 2214/02 (2013.01);
Abstract

A dielectric component with electrical connection is provided for a laminated heater mat () for an ice protection system for an aircraft (). The dielectric component with electrical connection comprises at least one dielectric layer () comprising thermoplastic material, and the dielectric layer () or a stack of the dielectric layers () has first and second main surfaces and a hole () extending between the first and second main surfaces. A first sprayed metal coating () comprises a first portion () deposited on the first main surface () adjacent to the hole () and a second portion () which projects into the hole. A second sprayed metal coating () comprises a third portion deposited on the second main surface () adjacent to the hole () and a fourth portion () which projects into the hole (). The second portion () overlaps the fourth portion () to form a continuous conductive path between the first main surface and the second main surface. This provides a cheap, neat and thin connection through the dielectric layer or the stack of dielectric layers.


Find Patent Forward Citations

Loading…