The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

Aug. 29, 2011
Applicants:

Kensuke Sakai, Tokyo, JP;

Keigo Kimura, Tokyo, JP;

Inventors:

Kensuke Sakai, Tokyo, JP;

Keigo Kimura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 11/11 (2006.01); B23K 11/31 (2006.01); B23K 11/36 (2006.01); B23K 37/04 (2006.01);
U.S. Cl.
CPC ...
B23K 11/115 (2013.01); B23K 11/314 (2013.01); B23K 11/36 (2013.01); B23K 37/0435 (2013.01); B23K 2201/185 (2013.01);
Abstract

When spot-welding a workpiece including a thin plate, a first thick plate, and a second thick plate, the workpiece is clamped by a fixed electrode in contact with the second thick plate, a movable electrode in contact with the thin plate, and control-pressure applying unit set adjacent to the movable electrode and in contact with the thin plate. Pressure is applied to the second thick plate by the fixed electrode, and pressure and control pressure are respectively applied by the movable electrode and the control-pressure applying unit to the thin plate. The pressure from the fixed electrode is controlled to be smaller than the pressure from the movable electrode. The current density between the thin plate and the first thick plate increases.


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