The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

Sep. 14, 2011
Applicants:

Tjalf Pirk, Stuttgart, DE;

Juergen Butz, Reutlingen, DE;

Axel Franke, Ditzingen, DE;

Frieder Haag, Wannweil, DE;

Heribert Weber, Nuertingen, DE;

Arnim Hoechst, Reutlingen, DE;

Sonja Knies, Rutesheim, DE;

Inventors:

Tjalf Pirk, Stuttgart, DE;

Juergen Butz, Reutlingen, DE;

Axel Franke, Ditzingen, DE;

Frieder Haag, Wannweil, DE;

Heribert Weber, Nuertingen, DE;

Arnim Hoechst, Reutlingen, DE;

Sonja Knies, Rutesheim, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/58 (2006.01); H01M 6/40 (2006.01); H01M 10/04 (2006.01); H01M 10/0525 (2010.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3121 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/58 (2013.01); H01M 6/40 (2013.01); H01M 10/0436 (2013.01); H01M 10/0525 (2013.01); H01L 24/24 (2013.01); H01L 24/96 (2013.01); H01L 23/5389 (2013.01); H01L 25/0655 (2013.01); Y02E 60/122 (2013.01); H01L 2224/24137 (2013.01); H01L 2924/10253 (2013.01);
Abstract

A method for constructing an electrical circuit that includes at least one semiconductor chip encapsulated with a potting compound is disclosed. The method includes applying a galvanic layer arrangement for forming an electrochemical element on an element of the electrical circuit including the at least one semiconductor chip.


Find Patent Forward Citations

Loading…