The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2015
Filed:
Jul. 18, 2008
Masayoshi Shimizu, Otsu, JP;
Hisayasu Kaneshiro, Uji, JP;
Shogo Fujimoto, Otsu, JP;
Kaneka Corporation, Osaka, JP;
Abstract
An object of this invention is to provide a polyimide film suitable for use in flexible printed circuit boards and the like which have high flexibility and dimensional stability, and to provide a laminate and metal-clad laminate which uses such a polyimide film. This invention relates to a multilayer polyimide film being a polyimide film having a multilayer structure, including: a core layer; and clad layers provided on each side of the film, which clad layers are exposed, the core layer being a non-thermoplastic polyimide having an average coefficient of linear expansion at a temperature from 100° C. to 200° C. in a range of 5 ppm/° C. to 20 ppm/° C., each of the clad layers being a polyimide having a peeling strength of 3 N/cm or less, the film as a whole having an average coefficient of linear expansion at a temperature range of 100° C. to 200° C. in a range of 9 ppm/° C. to 30 ppm/° C., and (a)>(b), where (a) is an average modulus of elasticity of the core layer and (b) is an average modulus of elasticity of the clad layers.