The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

Nov. 05, 2010
Applicant:

Yuichi Iida, Nagaokakyo, JP;

Inventor:

Yuichi Iida, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/24 (2006.01); B32B 7/02 (2006.01); B32B 18/00 (2006.01); H05K 1/03 (2006.01); H05K 1/18 (2006.01); H01L 23/13 (2006.01); H01L 23/538 (2006.01); H05K 3/46 (2006.01); B32B 3/26 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); B32B 7/02 (2013.01); H01L 23/13 (2013.01); H01L 23/5385 (2013.01); H05K 3/4629 (2013.01); H05K 3/4688 (2013.01); B32B 18/00 (2013.01); B32B 3/266 (2013.01); B32B 2250/42 (2013.01); B32B 2250/40 (2013.01); H01L 2924/09701 (2013.01); H05K 1/0271 (2013.01); H05K 1/0306 (2013.01); H05K 3/462 (2013.01); H05K 3/4697 (2013.01); H05K 2201/068 (2013.01); H05K 2203/061 (2013.01); H05K 2203/063 (2013.01); C04B 2235/9607 (2013.01); C04B 2237/62 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/19105 (2013.01); C04B 2237/343 (2013.01); C04B 2237/348 (2013.01); C04B 2237/562 (2013.01); C04B 2237/58 (2013.01); C04B 2237/68 (2013.01); C04B 2237/702 (2013.01); C04B 2237/704 (2013.01); Y10S 428/901 (2013.01);
Abstract

When a multilayer ceramic substrate with a cavity is reduced in thickness, a bottom wall portion defining the bottom of the cavity is reduced in thickness, thereby leading to the problem that the bottom wall portion is likely to be broken. A bottom wall portion defining a cavity of a multilayer ceramic substrate has a stack structure formed with a high thermal expansion coefficient layer sandwiched between first and second low thermal expansion coefficient layers. This configuration generates compression stress in the low thermal expansion coefficient layers during a cooling process after firing, thereby allowing the mechanical strength at the bottom wall portion to be improved.


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