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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8993064 B1

PDFFull Text
Date of Patent:
Mar. 31, 2015

Filed:

Nov. 12, 2010

Substrate for superconducting compound and method for manufacturing the substrate

Applicants:

Hironao Okayama, Kudamatsu, JP;

Kouji Nanbu, Kudamatsu, JP;

Akira Kaneko, Kudamatsu, JP;

Hajime Ota, Osaka, JP;

Kotaro Ohki, Osaka, JP;

Takashi Yamaguchi, Osaka, JP;

Kazuhiko Hayashi, Osaka, JP;

Kazuya Ohmatsu, Osaka, JP;

Inventors:

Hironao Okayama, Kudamatsu, JP;

Kouji Nanbu, Kudamatsu, JP;

Akira Kaneko, Kudamatsu, JP;

Hajime Ota, Osaka, JP;

Kotaro Ohki, Osaka, JP;

Takashi Yamaguchi, Osaka, JP;

Kazuhiko Hayashi, Osaka, JP;

Kazuya Ohmatsu, Osaka, JP;

Assignees:

Toyo Kohan Co., Ltd., Tokyo, JP;

Sumitomo Electric Industries, Ltd., Osaka-Shi, JP;

Attorney:

Browdy and Neimark, P.L.L.C.

Primary Examiner:

Colleen Dunn

Assistant Examiner:

Kallambella Vijayakumar

Int. Cl.
CPC ...
C22F 1/08 (2006.01); C23C 10/02 (2006.01); H01L 39/24 (2006.01); H01L 39/02 (2006.01); B32B 15/20 (2006.01); C22C 9/00 (2006.01); C22C 19/03 (2006.01);
U.S. Cl.
CPC ...
C22C 9/00 (2013.01); C22C 19/03 (2013.01); C22F 1/08 (2013.01); H01L 39/2454 (2013.01);
Abstract

Provided are a substrate for a superconducting compound and a method for manufacturing the substrate which can realize the excellent adhesive strength simultaneously with high orientation of copper. An absorbed material on a surface of a copper foil to which rolling is applied at a draft of 90% or more is removed by applying sputter etching to the surface of the copper foil, sputter etching is applied to a nonmagnetic metal sheet, the copper foil and the metal sheet are bonded to each other by applying a pressure to the copper foil and the metal sheet using reduction rolls, crystals of the copper in the copper foil are oriented by heating a laminated body formed by such bonding, copper is diffused into the metal sheet by heating with a copper diffusion distance of 10 nm or more, and a protective layer is laminated to a surface of the copper foil of the laminated body.

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