The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

May. 23, 2013
Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Koso Matsuno, Osaka, JP;

Michirou Yoshino, Osaka, JP;

Masayuki Takahashi, Osaka, JP;

Tooru Furushige, Osaka, JP;

Yuji Yamamoto, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01); B28D 5/00 (2006.01);
U.S. Cl.
CPC ...
B32B 38/10 (2013.01); B28D 5/0082 (2013.01); Y10S 156/93 (2013.01); Y10S 156/941 (2013.01);
Abstract

A device for peeling off silicon wafers, including: a supporting member that is configured to support a board-shaped member to which plural silicon wafers are bonded via an adhesive; a heating unit for heating the board-shaped member; a shifting mechanism that is configured to shift, in a horizontal direction, the supporting member relatively with respect to the heating unit; a peeling-off mechanism that is configured to peel off the silicon wafers one by one; and a container for allowing the silicon wafers, the board-shaped member and the supporting member to soak in a liquid.


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