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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8992712 B1

PDFFull Text
Date of Patent:
Mar. 31, 2015

Filed:

Nov. 21, 2012

Method for manufacturing electronic devices and electronic devices thereof

Applicant:

Arizona Board of Regents, a Body Corporate of the State of Arizona Acting for and on Behalf of Arizona State University, Scottsdale, AZ (US);

Inventors:

Douglas E. Loy, Chandler, AZ (US);

Emmett Howard, Gilbert, AZ (US);

Jesmin Haq, Tempe, AZ (US);

Nicholas Munizza, Gilbert, AZ (US);

Assignee:

Arizona Board of Regents, a Body Corporate of the State of Arizona Acting for and on Behalf of Arizona State University, Scottsdale, AZ (US);

Attorney:

Bryan Cave LLP

Primary Examiner:

Sing P Chan

Int. Cl.
CPC ...
B29C 65/48 (2006.01); B32B 37/12 (2006.01); B32B 38/10 (2006.01); B32B 43/00 (2006.01); H01B 13/00 (2006.01); H01L 21/20 (2006.01); H01L 21/683 (2006.01); H01L 23/498 (2006.01); H01L 27/12 (2006.01); H01L 29/786 (2006.01); H01L 51/00 (2006.01); B32B 7/02 (2006.01); H01L 51/05 (2006.01);
U.S. Cl.
CPC ...
H01B 13/00 (2013.01); H01L 21/2007 (2013.01); H01L 21/6835 (2013.01); H01L 23/49833 (2013.01); H01L 27/1266 (2013.01); H01L 29/78603 (2013.01); H01L 29/78636 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68381 (2013.01); H01L 2924/12044 (2013.01); H01L 51/003 (2013.01); H01L 51/0097 (2013.01); H01L 51/0508 (2013.01); H01L 2251/5338 (2013.01); Y02E 10/549 (2013.01); B32B 7/02 (2013.01); H01L 2924/0002 (2013.01); H01L 27/1218 (2013.01);
Abstract

In some embodiments, a method of manufacturing electronic devices including providing a carrier substrate having a first side, a second side, and a first adhesive at the first side; providing a first flexible substrate; and bonding the first flexible substrate to the first side of the carrier substrate. The first adhesive bonds the first flexible substrate to the first side of the carrier substrate. The carrier substrate comprises a mechanism configured to compensate for a deformation of the carrier substrate. Other embodiments are disclosed.

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