The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

Aug. 15, 2013
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Michael Hager, Sweet Home, OR (US);

Lawrence H White, Corvallis, OR (US);

Alexander N Govyadinov, Corvallis, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/05 (2006.01); B41J 2/14 (2006.01); B41J 2/045 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14112 (2013.01); B41J 2/0453 (2013.01); B41J 2/04533 (2013.01);
Abstract

A printhead die includes end regions, a nozzle surface region, fluid passages, ejection chambers, fluid ejectors, non-ejection chambers, and heating resistors. The nozzle surface region is disposed between the end regions. The fluid passages include corresponding ejection nozzles. The ejection nozzles are disposed on the nozzle surface region. The fluid ejectors correspond to the ejection chambers. Each one of the fluid ejectors selectively ejects printing fluid through a corresponding ejection nozzle. The plurality of heating resistors corresponds to the non-ejection chambers. The heating resistors selectively provide heat to the end regions while not ejecting printing fluid through the ejection nozzles.


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