The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2015
Filed:
Jul. 19, 2012
Applicants:
Frank Pueschner, Kelheim, DE;
Jens Pohl, Bernhardswald, DE;
Juergen Hoegerl, Regensburg, DE;
Wolfgang Schindler, Regenstauf, DE;
Inventors:
Frank Pueschner, Kelheim, DE;
Jens Pohl, Bernhardswald, DE;
Juergen Hoegerl, Regensburg, DE;
Wolfgang Schindler, Regenstauf, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/06 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/3121 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 23/4985 (2013.01); H01L 23/49855 (2013.01); H01L 23/49866 (2013.01); H01L 24/48 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48229 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00 (2013.01); H01L 2924/00014 (2013.01);
Abstract
In various aspects of the disclosure, a chip card module is provided. The chip card module may include a flexible substrate having a metallization on a first and second major surface, or side, thereof. An integrated circuit affixed to the second side is oriented with chip pads facing away from the substrate. Wire bonds may connect the chip pads to the metallizations.