The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2015
Filed:
Sep. 10, 2012
Applicants:
Daniel G. Sanders, Lake Tapps, WA (US);
Larry D. Hefti, Auburn, WA (US);
Gregory L. Ramsey, Seabeck, WA (US);
Inventors:
Daniel G. Sanders, Lake Tapps, WA (US);
Larry D. Hefti, Auburn, WA (US);
Gregory L. Ramsey, Seabeck, WA (US);
Assignee:
The Boeing Company, Chicago, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/00 (2006.01); B21D 26/02 (2011.01); B23K 31/02 (2006.01); B21D 26/055 (2011.01); B23K 20/02 (2006.01);
U.S. Cl.
CPC ...
B23K 31/02 (2013.01); B21D 26/055 (2013.01); B23K 20/023 (2013.01);
Abstract
A method of forming a pack in a die by superplastic formation and diffusion bonding comprises applying a forming pressure within the pack to expand the pack within the die; and supplying gas between the die and the pack to apply a back pressure around an outside of the pack while the pack is being expanded to counteract the forming pressure to reduce surface mark off.