The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

Jan. 23, 2014
Applicant:

Sunpower Corporation, San Jose, CA (US);

Inventors:

Ryan Linderman, Oakland, CA (US);

Thomas Phu, Alameda, CA (US);

Assignee:

Sunpower Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); H01L 31/042 (2014.01); H01L 31/05 (2014.01); B23K 1/00 (2006.01); B23K 1/002 (2006.01); B23K 1/012 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0508 (2013.01); B23K 1/0016 (2013.01); B23K 1/002 (2013.01); B23K 1/012 (2013.01); H01L 24/34 (2013.01); B23K 2201/38 (2013.01); B23K 2203/10 (2013.01); B23K 2203/12 (2013.01);
Abstract

A method for connecting a plurality of solar cells and an improved interconnect is disclosed. The method includes aligning an interconnect to a plurality of solar cells having solder pads, where the interconnect has a main body and tabs extending therefrom, and where each of the tabs has a downward depression, such that the tabs are positioned above the solder pads in between solar cells and pinning the interconnect against a work surface by pressing a hold down pin against the main body of the interconnect such that a lower surface of the interconnect tabs are maintained parallel to an upper surfaces of the solder pads, and such that the depression of each of the tabs flatly contacts the solder pads. The method can also include cantilevered tabs extending downwardly from the main body providing a controlled spring force between the tab lower surface and the solder pad upper surface.


Find Patent Forward Citations

Loading…