The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2015
Filed:
Aug. 19, 2010
Makoto Ikegami, Anjo, JP;
Hiroshi Oshitani, Toyoto, JP;
Etsuhisa Yamada, Kariya, JP;
Naohisa Ishizaka, Okazaki, JP;
Hirotsugu Takeuchi, Nagoya, JP;
Takeyuki Sugiura, Anjo, JP;
Takuo Maehara, Toyohashi, JP;
Makoto Ikegami, Anjo, JP;
Hiroshi Oshitani, Toyoto, JP;
Etsuhisa Yamada, Kariya, JP;
Naohisa Ishizaka, Okazaki, JP;
Hirotsugu Takeuchi, Nagoya, JP;
Takeyuki Sugiura, Anjo, JP;
Takuo Maehara, Toyohashi, JP;
Denso Corporation, Kariya, JP;
Abstract
An ejector cycle system with a refrigerant cycle through which refrigerant flows includes an ejector disposed downstream of a radiator, a first evaporator that evaporates refrigerant flowing out of the ejector, a throttling unit located in a branch passage and depressurizes refrigerant to adjust a flow rate of refrigerant, and a second evaporator located downstream of the throttling unit. In the ejector cycle system, a flow ratio adjusting means adjusts a flow ratio between a first refrigerant flow amount depressurized and expanded in a nozzle portion of the ejector and a second refrigerant flow amount drawn into a refrigerant suction port of the ejector, based on a physical quantity related to at least one of a state of refrigerant in the refrigerant cycle, a temperature of a space to be cooled by the first and second evaporators, and an ambient temperature of the space.