The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2015

Filed:

Sep. 07, 2011
Applicants:

William David Southcombe, San Diego, CA (US);

David E. Jones, Cedar Rapids, IA (US);

Chris Levesque, Fountain Valley, CA (US);

Scott Yoder, Fuquay Vertna, NC (US);

Terry J. Stockert, Cedar Rapids, IA (US);

Inventors:

William David Southcombe, San Diego, CA (US);

David E. Jones, Cedar Rapids, IA (US);

Chris Levesque, Fountain Valley, CA (US);

Scott Yoder, Fuquay Vertna, NC (US);

Terry J. Stockert, Cedar Rapids, IA (US);

Assignee:

RF Micro Devices, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 11/12 (2006.01); H04B 1/04 (2006.01); H03F 1/02 (2006.01); H03F 3/195 (2006.01); H03F 3/21 (2006.01); H03F 3/24 (2006.01); H03F 3/60 (2006.01); H03F 3/72 (2006.01);
U.S. Cl.
CPC ...
H03F 1/0227 (2013.01); H03F 1/0261 (2013.01); H03F 1/0277 (2013.01); H03F 3/195 (2013.01); H03F 3/211 (2013.01); H03F 3/245 (2013.01); H03F 3/602 (2013.01); H03F 3/72 (2013.01); H03F 2200/171 (2013.01); H03F 2200/222 (2013.01); H03F 2200/27 (2013.01); H03F 2200/318 (2013.01); H03F 2200/336 (2013.01); H03F 2200/387 (2013.01); H03F 2200/411 (2013.01); H03F 2200/414 (2013.01); H03F 2200/417 (2013.01); H03F 2200/451 (2013.01); H03F 2200/504 (2013.01); H03F 2200/534 (2013.01); H03F 2200/537 (2013.01); H03F 2200/541 (2013.01); H03F 2203/21106 (2013.01); H03F 2203/21142 (2013.01); H03F 2203/21157 (2013.01);
Abstract

Circuitry, which includes multi-mode multi-band radio frequency (RF) power amplification circuitry, power amplifier (PA) control circuitry, and a PA-digital communications interface (DCI) is disclosed according to one embodiment of the circuitry. The PA control circuitry is coupled between the amplification circuitry and the PA-DCI, which is coupled to a digital communications bus, and configures the amplification circuitry. The amplification circuitry includes at least a first RF input and multiple RF outputs, such that at least some of the RF outputs are associated with multiple communications modes and at least some of the RF outputs are associated with multiple frequency bands. Configuration of the amplification circuitry associates one RF input with one RF output, and is correlated with configuration information defined by at least a first defined parameter set. The PA control circuitry stores at least a first look-up table (LUT), which provides the configuration information.


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