The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2015

Filed:

Jul. 22, 2010
Applicant:

Seng-kum Chan, San Jose, CA (US);

Inventor:

Seng-Kum Chan, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); H01S 5/42 (2006.01); H01S 5/00 (2006.01); H01S 5/02 (2006.01); H01S 5/022 (2006.01);
U.S. Cl.
CPC ...
H01S 5/423 (2013.01); H01S 5/0042 (2013.01); H01S 5/0202 (2013.01); H01S 5/02236 (2013.01); H01S 5/02268 (2013.01); H01S 5/02276 (2013.01); H01L 2224/48091 (2013.01);
Abstract

An array of optical devices includes singlets diced or separated from a first diced surface and a second diced surface of a semiconductor wafer. Each singlet includes a single optical emitter or a single photosensitive semiconductor device. The singlets are identified as operationally fit before being arranged in corresponding features in a receiving region of a submount. The corresponding features of the submount are arranged to align and precisely control the pitch or separation distance between optical portions of a desired number of singlets. The use of operationally fit singlets dramatically increases production efficiency as it is no longer necessary to identify N contiguous operational optical devices in a semiconductor wafer to produce a precisely aligned array of N operational optical devices.


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