The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2015
Filed:
Nov. 02, 2011
Kiyoyasu Sakurada, Nagaokakyo, JP;
Kota Zenzai, Nagaokakyo, JP;
Hisayoshi Omori, Nagaokakyo, JP;
Takashi Kanayama, Nagaokakyo, JP;
Shinji Otani, Nagaokakyo, JP;
Naoki Shimizu, Nagaokakyo, JP;
Seiji Katsuta, Nagaokakyo, JP;
Kiyoyasu Sakurada, Nagaokakyo, JP;
Kota Zenzai, Nagaokakyo, JP;
Hisayoshi Omori, Nagaokakyo, JP;
Takashi Kanayama, Nagaokakyo, JP;
Shinji Otani, Nagaokakyo, JP;
Naoki Shimizu, Nagaokakyo, JP;
Seiji Katsuta, Nagaokakyo, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
A ceramic electronic component includes a ceramic body and an outer electrode. The outer electrode is disposed on the ceramic body. The outer electrode includes a first conductive layer and a second conductive layer. The first conductive layer includes a resin, a first metal component, and a second metal component having a higher melting point than the first metal component. The second conductive layer is disposed on the first conductive layer. The second conductive layer is includes a plating film. An alloy particle containing the first metal component and the second metal component protrudes to the second conductive layer side from a surface of the first conductive layer.