The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2015

Filed:

Sep. 23, 2014
Applicant:

Murata Manufacturing Co., Ltd, Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Satoshi Kodama, Nagaokakyo, JP;

Yosuke Terashita, Nagaokakyo, JP;

Seiji Katsuta, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/008 (2006.01); H01G 4/30 (2006.01); H01G 4/248 (2006.01); H01G 4/12 (2006.01); H01G 4/012 (2006.01); H01G 13/04 (2006.01);
U.S. Cl.
CPC ...
H01G 4/008 (2013.01); H01G 4/30 (2013.01); H01G 4/248 (2013.01); H01G 4/12 (2013.01); H01G 4/012 (2013.01); H01G 13/04 (2013.01);
Abstract

A ceramic electronic component includes a ceramic body and first and second outer electrodes. The first and second outer electrodes are located on the ceramic body. The first outer electrode includes a first resin electrode layer, and the second outer electrode includes a second resin electrode layer. Each of the resin electrode layers includes a conductive material and a resin. The moisture content of the resin electrode layers is about 0.005 mass % or less.


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