The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2015
Filed:
Oct. 04, 2013
Thin-film magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive
Yoshitaka Sasaki, Milpitas, CA (US);
Hiroyuki Ito, Milpitas, CA (US);
Shigeki Tanemura, Milpitas, CA (US);
Kazuki Sato, Milpitas, CA (US);
Seiichiro Tomita, Milpitas, CA (US);
Tatsuya Shimizu, Hong Kong, CN;
Yoshitaka Sasaki, Milpitas, CA (US);
Hiroyuki Ito, Milpitas, CA (US);
Shigeki Tanemura, Milpitas, CA (US);
Kazuki Sato, Milpitas, CA (US);
Seiichiro Tomita, Milpitas, CA (US);
Tatsuya Shimizu, Hong Kong, CN;
Headway Technologies, Inc., Milpitas, CA (US);
Sae Magnetics (H.K.) Ltd., Hong Kong, CN;
Abstract
A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, and a thin-film coil are laminated on a substrate. The thin-film magnetic head has a leading shield part opposing the main magnetic pole layer on the substrate side of the main magnetic pole layer, a substrate side shield part comes in contact with the leading shield part. The thin-film coil has a substrate side coil layer disposed between the main magnetic pole layer and the substrate. In the thin-film magnetic head, the spaces to the substrate about a leading lower end face of the leading shield part, a shield upper end face of the substrate side shield part, and coil upper end face of the substrate side coil layer are formed to be equal to each other. Further, a depth of the leading shield part is formed to be small than the depth of the substrate side shield part.