The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2015

Filed:

Feb. 17, 2011
Applicants:

Dong G. Kam, White Plains, NY (US);

Duixian Liu, Scarsdale, NY (US);

Scott K. Reynolds, Amawalk, NY (US);

Inventors:

Dong G. Kam, White Plains, NY (US);

Duixian Liu, Scarsdale, NY (US);

Scott K. Reynolds, Amawalk, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 13/10 (2006.01); H01Q 19/10 (2006.01); H01Q 1/22 (2006.01); H01Q 3/30 (2006.01); H01Q 9/04 (2006.01); H01Q 9/06 (2006.01); H01Q 21/06 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01Q 3/30 (2013.01); H01Q 9/0407 (2013.01); H01Q 9/065 (2013.01); H01Q 21/065 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/15321 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/1421 (2013.01);
Abstract

A chip package includes a plurality of layers including conductive planes connected by vias. The layers include a first portion having an antenna formed therein and a parallel-plate mode suppression mechanism to suppress parallel-plate mode excitation of the antenna. The parallel-plate mode suppression mechanism includes a reflector offset from an antenna ground plane and first grounded vias. A second portion has an interface for connecting to an integrated circuit device wherein the first portion and the second portion are separated by the parallel-plate mode suppression mechanism.


Find Patent Forward Citations

Kam, Dong. (2015). Integrated antenna for rfic package applications (U.S. Patent No. 8988299). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8988299

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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