The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2015

Filed:

May. 20, 2009
Applicants:

Jonghae Kim, San Diego, CA (US);

Feng Wang, San Diego, CA (US);

Matthew Nowak, San Diego, CA (US);

Inventors:

Jonghae Kim, San Diego, CA (US);

Feng Wang, San Diego, CA (US);

Matthew Nowak, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 17/00 (2006.01); H03K 19/003 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H03K 19/00392 (2013.01); H01L 25/0657 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06596 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An apparatus includes a first die having a first bus, a second die having a second bus stacked on the first die, a plurality of through silicon vias connecting the first bus to the second bus, and first control logic for sending data to identified ones of the plurality of through silicon vias. Also, optionally, second control logic for determining a first set of the plurality of through silicon vias that are nonfunctional, wherein the second control logic is configured to send information to the first control logic identifying the first set of the plurality of through silicon vias or identifying a second set of through silicon vias that are functional. Also a method of sending signals through a plurality of through silicon vias.


Find Patent Forward Citations

Kim, Jonghae. (2015). Method and apparatus for providing through silicon via (tsv) redundancy (U.S. Patent No. 8988130). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8988130

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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