The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2015

Filed:

Dec. 03, 2010
Applicants:

Tatsuya Murakami, Kakogawa, JP;

Tadataka Koga, Kakogawa, JP;

Koichi Kishimoto, Kakogawa, JP;

Inventors:

Tatsuya Murakami, Kakogawa, JP;

Tadataka Koga, Kakogawa, JP;

Koichi Kishimoto, Kakogawa, JP;

Assignee:

Daishinku Corporation, Kakogawa-shi, JP;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/047 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01); H03H 9/215 (2006.01);
U.S. Cl.
CPC ...
H01L 41/047 (2013.01); H03H 9/0509 (2013.01); H03H 9/1021 (2013.01); H03H 9/215 (2013.01);
Abstract

A lead type piezoelectric resonator device includes a piezoelectric resonator plate and a lead terminal that supports the piezoelectric resonator plate. The piezoelectric resonator plate is provided with a terminal electrode that is electrically connected to the lead terminal, and the lead terminal is provided with a bonding layer that is electrically connected to the piezoelectric resonator plate. The piezoelectric resonator plate and the lead terminal are electromechanically bonded to each other by the terminal electrode and the bonding layer. A bonding material containing an Sn—Cu alloy is produced from the terminal electrode and the bonding layer by the bonding of the terminal electrode and the bonding layer.


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